L373S-150-2.0数据手册PDF_L373S-150-2.0中文资料-锐单商城

L373S-150-2.0概述

T GLOBAL L373S-150-2.0 空隙填充导热垫, 2MM 片状

* Soft material highly compressible, easy to assemble, and provide good electrical insulation

.: Used on IC, CPU and MOS and connection between boards to enclosure walls to help heat conduction

.: Dissipates heat from LEDs, motherboards, PSUs, TVs, PCs, hubs, handsets, memory & hard drives

L373S-150-2.0数据文档