BGA-STD-010

ABL HEATSINKS  BGA-STD-010  散热器, 用于球栅阵列, 标准, BGA, 27 °C/W, 10 mm, 13.5 mm, 13 mm

The is a 13mm standard Heat Sink with aluminium, black anodized, thermal tape, 27°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.

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0.27mm Thickness