KEMET C0805X102KDRACTU 多层陶瓷电容器, 表面贴装, FT-CAP, AEC-Q200 X系列, 1000 pF, ± 10%, X7R, 1 kV, 0805 [2012 公制]
The X series surface mount Multilayer Ceramic Chip Capacitor in X7R dielectric address the primary failure mode of MLCCs - flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Featuring several of the highest CV capacitance/voltage values available in the industry, these devices utilize a pliable and conductive silver epoxy between the base metal and nickel barrier layers of the termination system. The addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short-circuit failures. Although flexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems.
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