FS3L50R07W2H3FB11BPSA1

EasyPACK™ 2B 650V 3-level NPC1 full-bridge IGBT module with NTC and PressFIT Contact Technology

Summary of Features:

.

High Speed IGBT H3

.

Low Switching Losses

.

CoolSiC™ Schottky Diode 650V

.

Al 2O 3 Substrate with Low Thermal Resistance

.

PressFIT Contact Technology

.

Rugged mounting due to integrated mounting clamps

Benefits:

.

Compact design

.

Optimized customer’s development cycle time and cost