FF1800R12IE5BPSA1

IGBT 模块 PP, IHM I, XHP 1,7KV

Summary of Features:

.

Extended Operation Temperature T vjop= 175°C

.

Output current increased by more than 25% in the same footprint

.

Copper Bonds for high current carrying capabilities

.

Sintering of chips for highest power cycling capabilities

.

Total losses reduced by up to 20%

.

Package with CTI > 400

 

Benefits:

.

Increase in Power Density by up to 25%

.

Up to 10 times longer lifetime

.

Less cooling effort for same output power

.

Enables higher system overload conditions